Overview Chili2S Thread IEEE802.15.4 Solder-down Module
The Chili2S Thread IEEE802.15.4 Solder-down Module is a highly-integrated postage-stamp module for Thread® / IEEE 802.15.4 low-power wireless area network applications. It combines an ARM® Cortex®-M23 TrustZone® microcontroller with the Cascoda CA-8211 Thread® certified 2.4 GHz IEEE 802.15.4 transceiver modem.
- OCF over Thread and Thread-certified component for every role
- Industry-leading receive sensitivity of -105dBm
- Programmable transmit power of -3dBm to +9dBm
- Industry-leading link budget of 114dB
- Integrated MAC low-power co-processor
- Industrial temperature range: -40°C to +85°C
- Wide supply voltage range: 2.1V to 3.6V
- Chip antenna and all other RF components integrated on module
- 16 MHz crystal for system clock and 32.768 kHz crystal for low-power RTC functionality
- Module size: 27.00 x 21.05 mm
ARM® Cortex®-M23 TrustZone® MCU
- Arm® Cortex®-M23 Architecture
- Highly robust security for IoT applications
- 512 KB dual-bank application ROM (APROM) for OverThe-Air (OTA) upgrade
- 96 KB on-chip SRAM
- Communication interfaces (UART, I2C, SPI, USB)
- Analog Interfaces (ADC, DAC, Comp)
- Smart Card (ISO 7816) and SD Card Interfaces
World-class energy consumption
- World’s best receiver efficiency :
14mA (42mW) at -105dBm sensitivity (0.0316nW)
Figure of Merit (FoM) 0.75 (mW*nW)-1
- 19mA at +9dBm transmit power
- 3µA sleep mode
Development Tools
- Raspberry Pi HAT. Find details here.
- Certified Thread stack based on OpenThread
- Support for the FreeRTOS operating system
- Optimised interface for the M2351 MCU and the CA8211 hardware MAC
- Module can be detached node running the network stack and application or coprocessor for hosts running Linux within a Thread mesh network
- Cascoda SDK, making full use of CMake as a build system
- Code available open-source on GitHub
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