KTA1550 Dual Active EMI/ESD Suppressor

Dual-channel Active Choke for EMI Suppression w/ Integrated ESD Protection

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Product Documents

Dual Channel Active EMI & ESD Suppressor for Ethernet Applications

  • Enables system designers to comply with:
  • CISPR22 and FCC Part 15, Class B requirements for Radiated and Conducted Emissions
  • IEC 61000-4-3 requirements for Radiated and Conducted Immunity, Level 3 or higher
  • IEC 61000-4-2 ESD (Air Discharge) of ±25kV
  • IEC 61000-4-2 ESD (Contact Discharge) of ±12kV
  • Cable Discharge Event (CDE) of ±12kV
  • Provides up to 10dB of additional common mode noise suppression over the frequency of 1MHz to 125MHz when used with Ethernet magnetics
  • Robust built-in ESD suppressors protect the Ethernet PHY and improve system ESD performance
  • JESD22-A114, ESD, HBM of ±8kV
  • Interfaces to standard Ethernet transformers and 10/100/1000 Ethernet PHYs
  • Uses a single standard power rail (3.3V or 2.5V)
  • Open drain output stage that can be biased from 1.8V to 3.3V using transformer center-tap supply as needed based on choice of Ethernet PHY
  • Flow-through routing for ease of board layout
  • Typical power consumption of 90mW
  • Low power mode available
  • Industrial temperature range (-40°C to +85°C)
  • Available in QSOP-16L (SOIC narrow) (Pin compatible with AS1602) and space-saving TDFN2.5×4-16 packages
  • Quad Channel version available here

Key Electrical Specifications

Vin (Min) Vin (Max)  CISPR22  FCC Part 15 IEC 61000-4-3 requirements for Radiated and Conducted Immunity   IEC 61000-4-2  ESD (Air Discharge)  IEC 61000-4-2 ESD  (Contact Discharge) Cable Discharge   Event (CDE) Package
 2.17V   or  3.13V   2.63V    or  3.47V Class B, for Radiated and Conducted Emissions Level 3 or higher ±25kV ±12kV ±12kV   QSOP-16L      (SOIC narrow), TDFN-4×2.5-16L

Typical Application Diagram


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