Description
Dual Channel Active EMI & ESD Suppressor for Ethernet Applications
- Enables system designers to comply with:
- CISPR22 and FCC Part 15, Class B requirements for Radiated and Conducted Emissions
- IEC 61000-4-3 requirements for Radiated and Conducted Immunity, Level 3 or higher
- IEC 61000-4-2 ESD (Air Discharge) of ±25kV
- IEC 61000-4-2 ESD (Contact Discharge) of ±12kV
- Cable Discharge Event (CDE) of ±12kV
- Provides up to 10dB of additional common mode noise suppression over the frequency of 1MHz to 125MHz when used with Ethernet magnetics
- Robust built-in ESD suppressors protect the Ethernet PHY and improve system ESD performance
- JESD22-A114, ESD, HBM of ±8kV
- Interfaces to standard Ethernet transformers and 10/100/1000 Ethernet PHYs
- Uses a single standard power rail (3.3V or 2.5V)
- Open drain output stage that can be biased from 1.8V to 3.3V using transformer center-tap supply as needed based on choice of Ethernet PHY
- Flow-through routing for ease of board layout
- Typical power consumption of 90mW
- Low power mode available
- Industrial temperature range (-40°C to +85°C)
- Available in QSOP-16L (SOIC narrow) (Pin compatible with AS1602) and space-saving TDFN2.5×4-16 packages
- Quad Channel version available here
Key Electrical Specifications
| Vin  (Min) | Vin  (Max) |  CISPR22  FCC Part 15 | IEC 61000-4-3 requirements for Radiated and  Conducted Immunity |  IEC 61000-4-2  ESD (Air Discharge) |  IEC 61000-4-2 ESD  (Contact Discharge) | Cable Discharge   Event (CDE) | Package |
|  2.17V   or  3.13V |  2.63V   or  3.47V | Class B, for Radiated and Conducted Emissions | Level 3 or higher | ±25kV | ±12kV | ±12kV |  QSOP-16L    (SOIC narrow), TDFN-4×2.5-16L |
Typical Application Diagram
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